| Technological Capabilities | Standard | Advanced |
|---|---|---|
| Minimum Outer Line Width | .003″ | .0025″ |
| Minimum Inner Line Width | .003″ | .0025″ |
| Minimum Outer Space, Trace/Trace | .003″ | .0025″ |
| Minimum Inner Space, Trace/Trace | .003″ | .0025″ |
| Minimum Space, PCB Edge to Conductor | .010″ | .005″ |
| Layer-to-Layer Registration | +/- .003″ | +/- .002″ |
| Maximum Finished PCB Thickness | .250″ | .400″ |
| Maximum Board Thickness Tolerance | +/- 10% | +/- 4% |
| Dimensions-Fab O.D. | .005″ | .003″ |
| Fabrication Radius | +/- 5 deg. | +/- 5 deg. |
| Warpage (inch per inch) (flatness of finished board) | .007″/inch | .003″/inch |
| Minimum Component Pitch | .008″ | .004″ |
| Minimum Dielectric Thickness | .0025″ | .0015″ |
| Maximum Number of Layers | 28 | 32+ |
| Impedance Control | +/- 10% | +/- 5% |
| Pad to Hole Size | Standard | Advanced |
|---|---|---|
| Tolerance – Plated Hole Size | +/-.003″ | +/-.0015″ |
| Minimum Plated Hole Size | .006″ | .003″ |
| Plane Relief Diameter over drilled hole | .018″ | .010″” |
| Minimum Outer Non-Plated Hole to Trace Spacing | .009″ | .005″ |
| Minimum Inner Non-Plated | .008″ | .005″ |
| Drilling | Standard | Advanced |
|---|---|---|
| Minimum Drill Size | .008″ | .004″ |
| Minimum Drill Size (Above .200 is routed) | .312″ | .312″ |
| Maximum Aspect Ratio | 10:1 | 16:1 |
| Micro Via Drilling | Standard | Advanced |
|---|---|---|
| Minimum Drill Size | .006″ | .004″ |
| Maximum Aspect Ratio | 1:1 | 1:1:5 |
| Testing Capabilities | Standard | Advanced |
|---|---|---|
| Minimum Component Pitch | .008″/side | .004″/side |
| Test Parameters | 250 volts 20 ohm resist 20 meg ohm iso |
1000 volts 50 ohm resist 50 meg ohm iso |
| Solder Mask Criteria | Standard | Advanced |
|---|---|---|
| Solder mask clearances Line coverage | .003″/side .004″ |
.002″/side .002″ |
| SMT Minimum Pad Spacing | .010″ | .007″ |
| Minimum Solder mask Dam | .004″ | .002″ |
| Solder Mask Criteria | Standard | Advanced |
|---|---|---|
| HASL Thickness | 40~400u” | 40~400u” |
| Immersion Silver Thickness | 6~18u” | 6~18u” |
| Immersion Ni/Au Thickness | 100~200u” Ni 2~4u” Au |
201~300u” Ni 2~4u” Au |
| Lead Free HASL Thickness | 80~300u” | 80~300u” |
| Hard Gold Thickness | 5~60u” | 61~80u” |
| Soft Gold Thickness | 5~100u” | 5~100u” |
| Other Capabilites | Standard | Advanced |
|---|---|---|
| Via Fill | Non-conductive | Conductive |
| Blind/Buried Vias | 3 sets | 4 and above |
| Micro Vias | Staggered | Stacked |
| Rigid Flex | 4~6 layers | 8~12 layers |
| Flex | 1~2 layers | 4 and above |
| Edge Castellation (plated edges) | Any Edges | Any Edges |
| Aluminum Core | 1~2 layers | 4 and above |